Padding Adhesives

XP5000

Hot Melt Padding Adhesive

  • Fast Drying - 3 to 4 Seconds
  • Designed for High Absorbent Paper Stocks
  • Clear Wafer Chips applied at 350 degrees

XP6000

Hot Melt Padding Adhesive

  • Fast Drying - 4 to 5 Seconds
  • Designed for Coated Paper Stocks
  • Clear Wafer Chips applied at 350 degrees

XP7000

Hot Melt Padding Adhesive

  • Medium Drying - 5 to 6 seconds
  • Add as a Strengthener
  • Amber Wafer Chips applied at 350 degrees
Business

785-862-7739

Cellular

785-806-2120

FAX 

785-862-7786

Mailing Address:

Glue XP
6021 SW 29th St
Suite A, PMB 210
Topeka, KS  66614

Physical Address:

Glue XP
2730 SW 57th St
E1 & E2
Topeka, KS  66609

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